United States of America, Phoenix
Semiconductor Packaging Lab Engineer
Location: arizona usa
Job Type: Full-time
If you are a talented Semiconductor Packaging Lab Engineer with a passion for innovation and excellence, we invite you to join our team. Apply today by submitting your resume and a cover letter outlining your relevant experience and qualifications
We are seeking a highly skilled and detail-oriented Semiconductor Packaging Lab Engineer to join our dynamic team. In this role, you will be responsible for the development and implementation of semiconductor packaging processes and techniques in our state-of-the-art lab. As a key member of our engineering team, you will contribute to the successful packaging of semiconductor devices, ensuring high-quality, reliable, and efficient solutions.
Collaborate with cross-functional teams to design and develop advanced semiconductor packaging solutions that meet product specifications and requirements.
Plan, execute, and analyze experiments to optimize packaging processes and improve yields, reliability, and performance.
Conduct failure analysis and root cause investigations to identify and resolve packaging-related issues and challenges.
Develop and implement packaging methodologies, techniques, and procedures in accordance with industry standards and best practices.
Perform design and layout reviews to ensure packaging compatibility and manufacturability.
Work closely with external suppliers and vendors to evaluate new materials, technologies, and equipment for packaging enhancements.
Conduct thorough testing and characterization of packaged devices, including electrical, mechanical, and thermal evaluations.
Generate detailed reports and documentation of packaging processes, experiments, results, and recommendations.
Stay updated on emerging packaging trends, technologies, and industry advancements to drive continuous improvement and innovation.
Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related field.
Solid understanding of semiconductor packaging principles, techniques, and methodologies.
Hands-on experience in packaging processes, including wire bonding, die attach, flip-chip bonding, encapsulation, and reliability testing.
Proficiency in using lab equipment and tools, such as bonders, wire pull testers, thermal cycling chambers, and microscopy systems.
Familiarity with industry standards and specifications related to semiconductor packaging, such as JEDEC, IPC, and ISO.
Knowledge of materials used in semiconductor packaging, such as solder, epoxy, mold compounds, and substrates.
Strong analytical and problem-solving skills with the ability to troubleshoot and resolve packaging-related issues.
Excellent communication and collaboration skills to work effectively with cross-functional teams.
Detail-oriented mindset with a focus on quality, accuracy, and precision in lab work and documentation.
Ability to multitask, prioritize, and meet project deadlines in a fast-paced and dynamic environment.
Competitive salary and benefits package.
Opportunities for professional growth and career advancement.
Access to cutting-edge technologies and equipment.
Collaborative and innovative work environment.
Training and development programs to enhance skills and knowledge.
If you are a talented Semiconductor Packaging Lab Engineer with a passion for innovation and excellence, we invite you to join our team. Apply today by submitting your resume and a cover letter outlining your relevant experience and qualifications to [email address]. Only shortlisted candidates will be contacted for further evaluation.